v rsm = 650 v , i f(av) = 5 a sic schottky diode fm da-1 05 65 fm da-1 05 65 -dsj rev. 1. 0 sanken electric co.,ltd. 1 jan. 06 , 2 01 6 features fm da-1 0565 is a sic schottky diode of 650 v / 5 a and has the characteristics of low reverse leakage current at high temperature and high speed switching. these characteristic s realize the improving of power supply efficiency, and the high frequency system. v rsm ---------------------------------------------------- 650 v i f(av) -------------------------------------------------------- 5 a v f ( 25 c ) ----------------------------------------------- 1.5 v applications the high speed switching applications as follows: pfc circuit motor drive circuit inverter circuit anodediode age to 220f- 2l not to scale absolute maximum ratings ? unless otherwise specified, t a is 25 c parameter symbol rating unit notes peak repetitive reverse voltage v rsm 650 v repetitive reverse voltage v rm 600 v average forward current i f(av) 5 a surge forward current i fsm 25 a 10 ms half sinewave, one shot junction temperature t j ? 40 to 1 75 c storage temperature t stg ? 40 to 1 75 c electrical characteristics ? unless otherwise specified, t a is 25 c parameter symbol test conditions min. t yp . m ax . unit forward voltage drop v f t a = 25 c , i f = 5 a ? 1.5 1.75 v t a = 100 c , i f = 5a ? 1.6 ? v reverse leakage current i r v r = v rm ? 15 100 a reverse leakage current under high temperature h ? i r v r = v rm , t j = 150 c ? 70 tbd a thermal resistance* r th(j -l) ? ? 2.5 c/w * r th(j -l ) is thermal resistance between junction and lead. http://www.sanken-ele.co.jp (1) (2) (1) cathode (2) anode downloaded from: http:///
fm da-1 0565 fm da-1 05 65 -dsj rev. 1. 0 sanken electric co.,ltd. 2 jan. 06 , 2 01 6 performance curves figure 1 typical forward characteristics figure 2 reverse leakage current vs. reverse voltage 0 5 10 15 0 1 2 3 4 forward current, i f (a) forward voltage drop, v f (v) 1.e- 09 1.e- 08 1.e- 07 1.e- 06 1.e- 05 1.e- 04 1.e- 03 0 100 200 300 400 500 600 reverse leakage current, i r (a) reverse voltage, v r (v) 150 c 100 c 25 c 25 c 100 c 150 c downloaded from: http:///
fm da-1 0565 fm da-1 05 65 -dsj rev. 1. 0 sanken electric co.,ltd. 3 jan. 06 , 2 01 6 package outline to 220f-2l notes: 1) dimension is in millimeters 2) pin treatment pb-free. device composition compliant with the rohs directive marking diagram 1 da0565 y m d d 2 part number lot number y is the last digit of year (0 to 9) m is the month (1 to 9, o, n or d) dd is the date (two digit of 01 to 31) downloaded from: http:///
fm da-1 0565 fm da-1 05 65 -dsj rev. 1. 0 sanken electric co.,ltd. 4 jan. 06 , 2 01 6 operating precautions in the case that you use sanken products or design your products by us ing sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating ma y be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stress es such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stresses, ins tantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that sin ce power devices or ics including power devices have large self-heating value, the degree of derating of junction tem perature affects the reliability significantly. because reliability can be affected adversely by improper storage environmen ts and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 3 5c) and the standard relative humidity (around 40 to 75%) ; avoid storage locations that experience extreme changes in temperature or h umidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlig ht. ? reinspect for rust on leads and solderability of the products that have bee n stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and w rong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using thermal silicone grease ? when thermal silicone grease is used, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? the thermal silicone grease that ha s been stored for a long period of time may cause cracks of th e greases, and it cause low radiation performance. in addition, the old grease may cause cr acks in the resin mold when screwing the products to a heatsink. ? fully consider preventing foreign materials from entering into the thermal silicone grease. when foreign material is immixed, radiation performance may be degraded or an insulation failu re may occur due to a damaged insulating plate. ? the thermal silicone greases that are recommend ed for the resin molded semiconductor should be used. our recommended thermal silicone grease is the following, and equivalent of these. type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials japan llc sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficient, such as whe n mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. for mounting the products, the mounting surface flatness should be 0 .05mm or less. ? please select suitable screws for the product shape. do not use a flat-head m achine screw because of the stress to the products . self-tapping screws are not recommended. when using self-tapping scre ws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole befor e threading or the work situation. that may stress the products and may cause failures. ? recommende d screw torque : package recommended screw torque to -220, to-220f 0.490 to 0.686 n ? m (5 to 7 kgf ? cm) to -3p, to-3pf , to - 247 0.686 to 0.882 n ? m (7 to 9 kgf ? cm) sla 0.588 to 0.784 n ? m (6 to 8 kgf ? cm) downloaded from: http:///
fm da-1 0565 fm da-1 05 65 -dsj rev. 1. 0 sanken electric co.,ltd. 5 jan. 06 , 2 01 6 ? for tightening screws, if a tightening tool (such as a driver) hits th e products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical element s and can cause catastrophic failure . tightening with an air driver makes a substantial impact. in addition, a screw torque higher than the set torque can be applied and the package may be damaged. therefore, an electric driver is r ecommended. when the package is tightened at two or more places, first pre-tighten w ith a lower torque at all places, then tighten with the specified torque . when using a power driver, torque control is mandatory. ? please pay special attention about the slack of the press mold. in case that the hole d iameter of the heatsink is less than 4 mm, it may cause the resin crack at tightening. soldering ? when soldering the products, please be sure to minimize the working time, within the following limits: ? 260 5 c 10 1 s (flow, 2 times) ? 380 10 c 3.5 0.5 s (soldering iron, 1 time) important notes ? the contents in this document are subject to changes, for improvement a nd other purposes, without notice. make sure that this is the latest revision of the document before use. ? application examples, operation examples and recommend ed examples described in this document are quoted for the sole purpose of reference for the use of the products herein and sa nken can assume no responsibility for any infringement of industrial property rights, intellectual property rights, life, body, property or any other rights of sanken or any third party which may result from its use. ? unless otherwise agreed in writing by sanken, sanken makes no warran ties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulne ss, and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its pr oducts, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sank en products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or m alfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunicatio n equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where high er reliability is required (transportation equipment and its control systems, traffic signal control systems or equ ipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems , life support systems, etc.) is strictly prohibited. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the produ cts, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as droppin g products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or copied without sankens written consent. downloaded from: http:///
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